An IR imaging system comprising microelectromechanical systems (MEMS) differential capacitive infrared sensors within a sensor array formed on a monolithic integrated circuit substrate, or flip chip bonded onto a signal processing chip fabricated separately, to include, a bimaterial deflectable element anchored to the substrate, a surface electrode fabricated on a top surface of the substrate and positioned below the deflectable element, the surface electrode and the deflectable element separated by a gap to form a first variable capacitor, a sealing ring surrounding the deflectable element and the surface electrode, an infrared transparent sealing cap electrode coupled to the sealing ring to form a vacuum cavity around the deflectable element and the surface electrode, the deflectable element and the sealing cap electrode separated by a gap to form a second variable capacitor and a micro-lens fabricated on the sealing cap electrode to focus the infrared radiation onto the bimaterial deflectable element.
Wang, Weidong and Bumgarner, John, "Differential capacitive readout system and method for infrared imaging" (2016). USF Patents. 841.
University of South Florida