A method of forming a multilevel conductor structure for ULSI circuits is provided. The structure includes a substrate having a plurality of dielectric supports extending from the substrate to support conductor layers. A removable material is deposited progressively on the substrate. An insulating â€˜domeâ€™ is formed over the conductor envelope and the material. Openings are provided through the dome for removing the material. The evacuated â€˜dome envelopeâ€™ is filled with a near-unity dielectric constant gas or liquid at or above atmospheric pressure to enhance heat removal. The openings are sealed to provide a dielectric medium around the conductors within the envelope. Metal conductors within the envelope electrically connect active devices to other active regions as well as to the external environment. Additionally, â€˜thermal columnsâ€™ extending through the envelope aid in heat removal, and inorganic â€˜support blocksâ€™ extending from the substrate to the dome provide mechanical integrity for external wire bonding.
Wade, Thomas E., "Gas dome dielectric system for ULSI interconnects" (2004). USF Patents. 760.
University of South Florida