Document Type
Patent
Publication Date
August 2007
Patent Number
7255800
Abstract
The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon formation and dissolution to create high aspect ratio structures with straight sidewalls for through wafer MEMS processing.
Application Number
10/710,984
Recommended Citation
Bhansali, Shekhar; Abdur, Abdu Rub; and Kedia, Sunny, "Wet etching process" (2007). USF Patents. 632.
https://digitalcommons.usf.edu/usf_patents/632
Assignees
University of South Florida
Filing Date
08/16/2004
Primary/U.S. Class
216/2
COinS
