H01L 29/408(20130101), G03F 1/42(20130101), H01L 21/283(20130101)
In one embodiment, an electrical circuit formed on a substrate includes a first multi-layer stack and a second multi-layer stack that share a top layer that comprises a continuous piece of conductive material.
Ratnadurai, Rudraskandan; Krishnan, Subramanian; and Bhansali, Shekhar, "Systems and methods for forming contact definitions" (2015). USF Patents. 52.
University of South Florida