In accordance with an embodiment of the present invention, a thermally induced single-use valve is provided including a silicon wafer having a top surface and a bottom surface and at least one cavity formed in the bottom surface of the wafer, a thermally deformable membrane suspended across the cavity on the top surface of the wafer and at least one resistive element patterned on top of the thermally deformable membrane.
Cardenas-Valencia, Andres M.; Dlutowski, Jay; Cardenas, Michelle; Bumgarner, John; Wang, Weidong; and Langebrake, Larry, "Thermally induced single-use valves and method of use" (2011). USF Patents. 406.
University of South Florida