Document Type
Patent
Publication Date
February 2011
Patent Number
7892440
Abstract
The present invention illustrates a bulk silicon etching technique that yields straight sidewalls, through wafer structures in very short times using standard silicon wet etching techniques. The method of the present invention employs selective porous silicon formation and dissolution to create high aspect ratio structures with straight sidewalls for through wafer MEMS processing.
Application Number
11/828,639
Recommended Citation
Bhansali, Shekhar; Rahman, Abdur Rub Abdur; and Kedia, Sunny, "Wet etching process" (2011). USF Patents. 381.
https://digitalcommons.usf.edu/usf_patents/381
Assignees
University of South Florida
Filing Date
07/26/2007
Primary/U.S. Class
216/2
COinS
