Provided is a method for enhancing an adhesive bond between a pile and a resin adhesive by maintaining a constant uniform positive pressure of the entire wrapped region regardless of the shrinkage in the resin adhesive. This invention enhances underwater adhesive bond by ensuring proper contact while curing. In one embodiment, constant inward pressure is created by encapsulating the repair and applying a vacuum. The invention can be used for a variety of underwater applications using different resins and different substrate materials. For instance, the invention could be used to repair damaged critical infrastructure, e.g. Bridges, dams, pipelines and locks. Local, state and federal agencies in US and elsewhere as well as marine and naval contractors would find great utility with the invention. The concept could be extended to all adhesion dependent repairs.
Mullins, Gray and Sen, Rajan, "Bond enhancement for underwater repair" (2011). USF Patents. 370.
University of South Florida