Investigation of Surface Tension Effects of a Water-Hexadecane Interface on Silicon Microparts

Document Type

Conference Proceeding

Publication Date

2011

Digital Object Identifier (DOI)

https://doi.org/10.1115/IMECE2011-64515

Abstract

Assembly at sub-millimeter dimensions is a challenging process that is often not economically feasible. This limits many systems to in-situ fabrication from compatible materials. If freed from these limitations on processes and materials, it might be possible to improve microsystem performance. One critical application of recent interest is in the assembly of small crystalline photovoltaic cells onto low-cost and possibly flexible modules [1].

Was this content written or created while at USF?

Yes

Citation / Publisher Attribution

ASME 2011 International Mechanical Engineering Congress and Exposition, v. 11, p. 653-654, art. IMECE2011-64515

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