Self-Assembly for Integration of Microscale Thermoelectric Coolers
thermoelectric cooler, self-assembly, Monte Carlo simulation, bismuth telluride
Digital Object Identifier (DOI)
Optimum thermoelectric cooling (TEC) solutions often require the integration of component sizes inaccessible by common manufacturing techniques such as thin-film processing and robotic assembly. This work considers an application case in which small elements (100 μm to 300 μm thick) are optimal. A capillary self-assembly process is presented as a potential route to manufacturing TECs in these size ranges. A millimeter-scale demonstration of the assembly concept is presented and Monte Carlo simulation is used to study the scaling of the self-assembly approach to assemblies with more components. While assembly rate and system yield can be a challenge, several approaches are presented for increasing both rate and yield.
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Citation / Publisher Attribution
Journal of Electronic Materials, v. 38, issue 7, p. 1252-1256
Scholar Commons Citation
Crane, Nathan B.; Mishra, Pradeep; Murray, Jeffrey L.; and Nolas, G S., "Self-Assembly for Integration of Microscale Thermoelectric Coolers" (2009). Mechanical Engineering Faculty Publications. 30.