Graduation Year

2004

Document Type

Thesis

Degree

M.S.I.E.

Degree Granting Department

Industrial Engineering

Major Professor

Das, Tapas K.

Keywords

wavelet based multiresolution, real-time multiscale analysis, SPRT

Abstract

Complex industrial processes are represented by data that are well known to be multiscaled due to the variety of events that occur in a process at different time and frequency localizations. Wavelet based multiscale analysis approaches provide an excellent means to examine these events. However, the scope of the existing wavelet based methods in the fields of statistical applications, such as process monitoring and defect identification are still limited. Recent literature contains several wavelet decomposition based multiscale process monitoring approaches including many real life process monitoring applications, such as tool-life monitoring, bearing defect monitoring, and monitoring of ultra-precision processes such as chemical mechanical planarization (CMP) in wafer fabrication. However, all of the above mentioned wavelet based methodologies are offline and depend on the visual observations of the wavelet coefficients and details.

The offline analysis paradigm was imposed by the high computation needs of the multiscale analysis, whereas the visual observation based approach was necessitated by the lack of statistical means to identify undesirable events. One of the most recent multiscale application, that deals with detecting delamination in CMP, addressed the need for online analysis by developing a moving window based approach to reduce computation time. This research presents 1) development of a fully online multiscale analysis approach where the speed of wavelet based analysis of the data matches the rate of data generation, 2) development of a statistical tool based on Sequential Probability Ratio Test (SPRT) to detect events of interest, and 3) development of an approach to display the analysis results through real time graphs for ease of process supervisory decision making.

The developed methodologies are programmed using MATLAB 6.5 and implemented on several data sets obtained from metal and oxide CMP of wafer fabrication. The results and analysis are presented.

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