Title

Self-Assembly for Integration of Microscale Thermoelectric Coolers

Document Type

Article

Publication Date

2009

Keywords

thermoelectric cooler, self-assembly, Monte Carlo simulation, bismuth telluride

Digital Object Identifier (DOI)

https://doi.org/10.1007/s11664-008-0627-9

Abstract

Optimum thermoelectric cooling (TEC) solutions often require the integration of component sizes inaccessible by common manufacturing techniques such as thin-film processing and robotic assembly. This work considers an application case in which small elements (100 μm to 300 μm thick) are optimal. A capillary self-assembly process is presented as a potential route to manufacturing TECs in these size ranges. A millimeter-scale demonstration of the assembly concept is presented and Monte Carlo simulation is used to study the scaling of the self-assembly approach to assemblies with more components. While assembly rate and system yield can be a challenge, several approaches are presented for increasing both rate and yield.

Was this content written or created while at USF?

Yes

Citation / Publisher Attribution

Journal of Electronic Materials, v. 38, issue 7, p. 1252-1256

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